Innovation and Design Fellow
John Manderfield is with Altium Packaging, Atlanta GA, a supplier of rigid blow molded packaging and closures, serving the role of Innovation and Design Fellow.
He has a BFA in Industrial Design from Carnegie-Mellon University, where he studied design, business and computer science.
John has a passion for creative design, sustainability, innovation, and transformation.
John’s current role is to collaborate with industry suppliers and subject matter experts to continue to bring innovation to the market.