John Manderfield
Innovation and Design Fellow
Altium Packaging

John Manderfield is with Altium Packaging, Atlanta GA, a supplier of rigid blow molded packaging and closures, serving the role of Innovation and Design Fellow.

He has a BFA in Industrial Design from Carnegie-Mellon University, where he studied design, business and computer science.

John has a passion for creative design, sustainability, innovation, and transformation.

John’s current role is to collaborate with industry suppliers and subject matter experts to continue to bring innovation to the market.